飞思卡尔(Freescale)公司的MC1322x是第三代 ZigBee封装内平台(PiP),集成了完整的低功耗2.4GHz无线电收发器,基于32位ARM7核的MCU,用于IEEE 802.15.4 MAC 和AES安全加密的硬件加速器以及MCU成套外设,是高密度低元件数的IEEE 802.15.4综合解决方案,能实现点对点连接和完整的ZigBee网状网络,因此可广泛应用在住宅区和商业自动化,工业控制,HVAC, 卫生保健和消费类电子等产品.本文介绍采用MC1322x的1322x-LPB低功耗板的主要特性,详细的电路图以及所用的元器件清单(BOM).

MC13224V Advanced ZigBee"- Compliant Platform-in-Package (PiP) for the 2.4 GHz IEEE® 802.15.4 Standard The MC13224V is Freescale’s third-generationZigBee

platform which incorporate a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a fullsetof MCU peripherals into a 99-pinLGA Platform-in-Package (PiP).

The MC13224V solutioncanbe used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC13224V is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption.

The MC13224V MCU resources offer superior processing power for ZigBee applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM is available for boot software, standardized IEEE 802.15.4 MAC and communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for transceiver packet data complement the processor core.

Freescale has created the most complete set of hardware platforms for evaluating the MC1322x Platform in Package" (PiP), allowing the developer to select the hardware and software platform that best meets their needs. The development boards include LEDs, push buttons, connectors, header pins and a programming/debug port. The boards can be powered by batteries, a DC adapter or theUSBport. The JTAG port allows easy programming of the MC1322x flash memory via the J-link JTAG debugger, which enables the users to program the MCU with a variety of sample applications included with the BeeKit software. The MC1322x development kits are the ideal platform for more complex IEEE® 802.15.4 and ZigBee applications by providing plenty of memory and expansion capabilities. Unique to the MC1322x is the capability the boost speed 8x over IEEE® 802.15.4 data rates. This capability is better suited for applications such as voice, wireless headsets, and compressed audio. The development board features a headset jack for demonstration and development of these applications.

The unique PiP design integrates the 2.4 GHz transceiver, ARM7TDMI, memory, I/O and RF matching components into a single package, significantly reducing the component cost and solution size. The MC1322x development kits are the ideal platforms for more complex 802.15.4 and ZigBee applications, providing plenty of memory and expansion capabilities.

1322x-SRB(Sensor Reference Board)

The 1322x-SRB contains an MC13224 PiP, an MMA7260Q three-axis acceleration

sensor, MPXV5010G pressure sensor and a temperature sensor. The SRB provides

a complete platform for evaluating the MC13224 PiP.

1322x-NCB (Network Coordinator Board)

The 1322x-NCB contains the MC13224 IC and a graphic LCD, creating the ideal

demonstration platform for network coordinators. The LCD enables network monitoring by providing status messages.

1322x-LPB (Low Power Board)

The 1322x-LPB contains the MC13224 and is ideal for power measurements. The small

form factor supports both AAA batteries and coin cell use and has the optional buck

converter enabled to provide a low power option.

1322x-USB

The 1322x-USB is programmed to function as an 802.15.4/ZigBee packet sniffer and can be used with the Daintree Sensor Network Analyzer software. The device can also be reprogrammed to support customer applications, providing a small form factor device for PC connectivity.

MC1322x-Low Power Board (1322x-LPB)

The 1322x-LPB is an IEEE 802.15.4 compliant wireless node based on the Freescale MC1322x device. The heart of the MC1322x USB module is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption.

The 1322x-LPB provides a platform to evaluate the MC1322x device, develop software and applications, demonstrate IEEE 802.15.4 and ZigBee networking capabilities, and implement low power operation. The small form factor illustrates a small footprint, 2-layer printed circuit board (PCB) layout with integrated printed-wire F-antenna. The LPB provides a GPIO connector to interface with application devices, a separate second unbuffered UART connector, and a full JTAG debug port connector.

The 1322x-LPB is specifically intended as a prototype development platform for low power applications, use of the buck converter, 2-layer PCB design, use of the 32.768 crystal oscillator, and non-standard crystal reference oscillators (requiring PLL operation).

1322x-LPB 主要特性:

The 1322x-LPB provides the following features:

Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack

Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP)

MC1322x provides a highly integrated, low cost RF node

―On-board balun and antenna switch in package

―Typical -95 dBm sensitivity

―Typical 0 dBm output power, with max approximately +4 dBm

―F-antenna